Electronic device with airflow field

ABSTRACT

An electronic device with airflow field is disclosed, which comprises a housing, several heat sources, a plurality of openings, an air inlet and an air outlet module. By the use of sealed structure of electronic device, the airflow field can be formed inside the housing to direct the airflow for passing through the surface and bottom of each heat source, for the purpose of taking the heat away from the heat sources and promoting the efficiency of heat dissipating greatly. The axial direction of the fan is vertical to the supporting body for forming a sealed space with a local high pressure. It can raise the flow rate and lower the noise of the wind shear from turbulent flow.

FIELD OF THE INVENTION

The present invention relates to an electronic device; particularly to adevice with an airflow field, which can make airflow passing the surfaceand bottom of each heat source.

DESCRIPTION OF PRIOR ART

Nowadays consumer electronic devices, such as a central processing unit(CPU) and peripheral electronic units or parts of a motherboard will beheated under running or working. A heat dissipating module or a fanmodule usually is embedded in the system to dissipate heat, so as toavoid cracking down or damaging the delicate device due to over-heated.With advancing technology, all kinds of electronic devices willgradually become more delicate and bring more heat. So larger or morefans are needed in the system for preventing CPU cracking down orshortening the life time of internal device due to poorheat-dissipating.

Sometimes we cannot install a larger fan with considering the sizematter of the products. Besides, the fans in smaller size and withbetter heat-dissipating efficiency will be definitely more expensive.Usually larger fans resulted in louder noise, and the cost and size ofthe product increases as the amount of fans. The drawbacksabove-mentioned is urgent. Therefore, how to decrease the cost andpromote the heat-dissipating efficiency is very important.

In order to solve all problem encountered in prior-art nowadays,inventors based on practical experience of multiple years develop anelectronic device with airflow field to improve the drawbacks asmentioned above.

SUMMARY OF THE INVENTION

The first object of this present invention is to provide an electronicdevice with an airflow field. By the use of sealed structure ofelectronic device, the airflow field can be formed inside the housingand the air can flow through the surface and bottom of each heat source,which can bring heat away by airflow field so that efficiency of heatdissipating can be improved substantially.

The second object of this present invention is to provide an electronicdevice with airflow field, for which the fan is vertical to the airoutlet so that a containing space will be formed and it can reduce thenoise.

In order to achieve the objects as mentioned above, this presentinvention disclosed an electronic device with airflow field comprising:a housing, several heat sources, a plurality of openings, an air inletand an outlet module.

A plurality of supporting bodies mutually arranged one another inparallel are laid in the housing and separated into several containingspace. Each heat source is installed on a supporting body respectively,and a gap will be formed between the top side of each heat source andanother supporting body. Each opening is located on the supportingbodies, and the air can flow from one containing space to anothercontaining space by these gaps. The airflow flows from the air inletinto the housing. The air outlet module comprises an air outlet and afan corresponding to the air outlet. The air outlet is parallel with thesupporting body, and the axial direction of fan is vertical to thesupporting body.

In preferred embodiment of this present invention, the air outlet modulefurther comprises an airflow casing installed at a locationcorresponding to the fan and air outlet. The airflow flows by theairflow casing through the air outlet and flow out from the housing.

To make it easier for our examiner to understand the objective of theinvention, its structure, innovative features, and performance, we usepreferred embodiments together with the attached drawings for thedetailed description of the invention.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is the structure schematic diagram showing the electronic devicewith airflow field of preferred embodiment according to this presentinvention; and

FIG. 2 is the structure schematic diagram showing the air outlet moduleof electronic device with airflow field of preferred embodimentaccording to this present invention.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

As mentioned above, this present invention of the electronic device withairflow field is charactered with an improved heat-dissipatingefficiency by the airflow field structure. The heat of all heat sourcescan be dissipated with a fan only, hence the cost will be lower, and thenoise problem and the efficiency of heat dissipating will be improved.

In the related figures of preferred embodiments of an electronic devicewith airflow field of the present invention, the same referring numeralsare used for the same components in accordance with the presentinvention.

Please refer to FIG. 1 for a schematic diagram of side viewingcross-section structure for a preferred embodiment of this presentinvention of electronic device with airflow field. This presentinvention comprises: a housing 11, an air inlet 12, an air outlet module2, a plurality of heat sources 14 and a plurality of supporting bodies16. A plurality of supporting bodies 16 mutually arranged one another inparallel are laid in the housing 11 which separated into severalcontaining spaces 17. A plurality of heat sources 14 such as electronicunits or hard disk are installed on the supporting body 16. A gap(s) isformed inside between the top side of each heat source 14 and anothersupporting body 16. Each supporting body 16 comprises at least one gap18 which channels the air from the containing space 17 to anothercontaining space 17 a. In this preferred embodiment, there are threesupporting bodies 16, 16 a, and 16 b in the system. First supportingbody 16 is a motherboard where several electronic units are installed.The electronic units bring heat after working. While the second andthird supporting bodies 16 a, 16 b both support a hard disk respectivelywhich also brings heat at running. Therefore in this example, heatsources 14, 14 a are embodied respectively as an electronic unit or ahard disk.

The airflow direction of the air inlet 12 is approximately parallel tothe supporting bodies 16, so the air flows into the housing 11 via airinlet 12. The airflow flows as the direction with pointing arrows shownin the figure. Firstly, the airflow flows from the top side of heatsource 14 (electronic devices) to the other side of housing 11, and thenflows into the other containing space 17 a via the opening 18 by theblock of housing 11 through the gap (s). The airflow will bring away theheats generated by heat source 14 a (hard disk) and the bottom side ofsupporting body 16. In this preferred embodiment, when airflow in thegap (s) flows to the other side (same side as air inlet 12) of housing11, the airflow will flow into another containing space 17 b via theopening 18 a by the block of housing 11. The airflow will also flow intothe air outlet module 2 through the bottom side of supporting body 16 band the top side of heat source 14 b (hard disk). Therefore, we canachieve the object of heat-dissipating by the design of this airflow torelease air to outside of the housing 11 with only a fan 21 at airoutlet module 2. The efficiency of heat-dissipating can be also improvedsubstantially due to the airflow passing through top side and bottomside of each heat source 14.

Please refer to FIG. 2 for the structure schematic diagram of preferredembodiment of the air outlet module of electronic device with airflowfield. In this preferred embodiment, the air outlet module 2 comprisesan air outlet 22 and a fan 21 corresponding to the air outlet 22. Theair outlet 22 is approximately parallel to the supporting body 16, andthe axial direction of fan is approximately vertical to the supportingbody 16. The embodiment prefers to have an airflow casing 23, thus asealed space is formed by the combination of a fan 21 and air outlet 22connecting to the airflow casing 23. When the fan 21 runs, the air belowthe fan 21 will be pumped out into the sealed space leading to a localhigh pressure in this sealed space, and the air flows out from the airoutlet 22 and such pressure results in the increase of flow rate. Due tothe airflow passing via the fan 21 with a steady flow rate, theturbulent flow will be improved and the noise of wind shear will belower efficiently.

While the present invention has been described by way of example and interms of a preferred embodiment, it is to be understood that the presentinvention is not limited thereto. To the contrary, it is intended tocover various modifications and similar arrangements and procedures, andthe scope of the appended claims therefore should be accorded thebroadest interpretation so as to encompass all such modifications andsimilar arrangements and procedures.

1. An electronic device with an airflow field comprises: a housing withseveral supporting bodies arranged one another in parallel which isseparated into several containing spaces; several heat sources which arerespectively located on the supporting bodies, and a gap is formedbetween the top side of each heat source and another supporting body; aplurality of openings formed on the supporting body which channels fromthe containing space another containing space; an air inlet whichprovides airflow for flowing into the housing; and an air outlet modulewhich comprises an air outlet and a fan corresponding to the air outlet,and the air outlet is parallel with the supporting body, and the axialdirection of the fan is vertical to the supporting body; wherein, theairflow flows into the housing with the fan through every gap and everyopening, and then flow out from the housing via openings.
 2. Theelectronic device with airflow field according to claim 1 wherein theair outlet module further comprises an airflow casing corresponding tothe fan and the air outlet, and the airflow casing is to direct theairflow flowing through the air outlet and flow out from the housing.